Sains Malaysiana 52(11)(2023): 3261-3271
http://doi.org/10.17576/jsm-2023-5211-18
Effect of Sn Plating
Thickness on Wettability, Solderability, and
Electrical Connections of Electronic Lead Connectors for Surface Mount
Technology Applications
(Kesan Ketebalan Saduran Sn terhadap Kebolehbasahan, Kebolehpaterian dan Sambungan Elektrik bagi Kaki Penyambung Elektronik untuk Aplikasi Teknologi Lekapan Permukaan)
MARIA ABU BAKAR1,*,
MOHAMAD SOLEHIN MOHAMED SUNAR1,2, AZMAN JALAR1,3, A
ATIQAH1, FAKHROZI CHE ANI2, IBRAHYM AHMAD2 & ZOL EFFENDI ZOLKEFLI2
1Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor, Malaysia
2Western Digital®,
SanDisk Storage Malaysia Sdn. Bhd. Plot 301A, Persiaran Cassia Selatan 1, Taman Perindustrian Batu Kawan, MK13, Batu Kawan, Seberang Perai Selatan, 14100, Penang, Malaysia
3Department
of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, 43600 UKM Bangi,
Selangor, Malaysia
Diserahkan: 1 Ogos 2023/Diterima: 19 Oktober 2023
Abstract
The wettability of solder is important to achieve
good solderability between the electronic component
and printed circuit board (PCB). Tin (Sn) plating is widely used to promote the
wettability of the solder on the substrates. However, an adequate amount of Sn
plating thickness must be taken into consideration to acquire good wettability
and solderability. Thus, this study investigates the
Sn plating thickness of the electronic lead connector and their effect on the
wettability and electrical connection. Two types of Sn plating thicknesses, ~3 μm, and 5 μm were
applied on the electronic lead connector surface. It was found that the thin Sn
plating thickness of ~3 μm has shown failure in
electrical connections and lack of solder joint wettability and solderability properties. A thicker Sn plating thickness of
5 μm, has shown better wettability and solderability properties. In addition, the electrical
connections also passed which implies that the thicker Sn plating thickness
provides good solder joint establishment leading to good electrical
connections. It is also observed that the better wettability of solder has been
achieved for thicker Sn plating thickness. The finding from the field emission
scanning electron microscope (FESEM) shows that the intermetallic compound
(IMC) layer growth in the lead connector surface is regarded as abnormal for
thin Sn plating thickness (~3 μm), in which the
IMC layer was consumed and penetrating up to the surface of Sn-coating. This has led to poor solderability of the thin Sn plating with the solder to establish solder joint. The findings
from this study have shed some light upon a better understanding of the
importance of considering the adequate amount of Sn coating thickness to avoid
IMC consumption at the Sn plating, better wettability properties, solderability, and solder joint quality for surface mount
technology (SMT) especially for electronic lead connector applications.
Keywords: Electronic lead connector;
IMC consumed at Sn plating; Sn plating thickness; solderability;
surface mount technology; wettability
Abstrak
Kebolehbasahan pateri adalah penting untuk mencapai kebolehpaterian yang baik antara komponen elektronik dan papan litar bercetak (PCB). Saduran timah (Sn) digunakan secara meluas untuk menggalakkan kebolehbasahan pateri pada substrat. Walau bagaimanapun, ketebalan saduran Sn yang mencukupi harus diambil kira untuk memperoleh kebolehbasahan dan kebolehpaterian yang baik. Oleh itu, penyelidikan ini mengkaji ketebalan saduran Sn pada kaki penyambung elektronik dan kesannya terhadap kebolehbasahan dan sambungan elektrik. Dua jenis ketebalan saduran Sn, ~3 μm, dan 5 μm diaplikasikan pada permukaan kaki penyambung elektronik. Didapati bahawa saduran Sn yang nipis, ~3 μm telah menunjukkan kegagalan sambungan elektrik dan kekurangan dari segi sifat kebolehbasahan dan kebolehpaterian sambungan pateri. Saduran Sn yang tebal, 5 μm menunjukkan sifat kebolehbasahan dan kebolehpaterian yang lebih baik. Di samping itu, sambungan elektrik yang lulus menunjukkan bahawa ketebalan saduran Sn yang tebal menghasilkan sambungan pateri yang baik seterusnya memberikan sambungan elektrik yang baik. Turut diperhatikan bahawa kebolehbasahan pateri yang baik dicapai untuk saduran Sn yang tebal. Keputusan mikroskop elektron imbasan medan pancaran (FESEM) juga menunjukkan bahawa pertumbuhan lapisan sebatian antara logam (IMC) pada permukaan kaki penyambung dengan saduran Sn nipis (~3 μm) adalah tidak normal, yang mana lapisan IMC telah memakan dan menembusi ke permukaan saduran Sn. Ini mengakibatkan kebolehpaterian yang lemah antara pateri dan saduran Sn nipis untuk menghasilkan sambungan pateri. Penemuan daripada kajian ini telah memberikan pencerahan dan pemahaman yang lebih baik tentang kepentingan untuk mengambil kira ketebalan saduran Sn yang mencukupi bagi mengelakkan IMC memakan saduran Sn, sifat kebolehbasahan, kebolehpaterian dan kualiti sambungan pateri yang baik bagi teknologi lekapan permukaan (SMT) khususnya bagi aplikasi kaki penyambung elektronik.
Kata kunci: IMC memakan saduran Sn; kaki penyambung elektronik; kebolehbasahan; kebolehpaterian; ketebalan saduran Sn; teknologi lekapan permukaan
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*Pengarang untuk surat-menyurat; email: maria@ukm.edu.my
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